Three target magnetron sputtering coater with molecular pump system for coating glass wafer

  • 1 - 1 Sets
    $49,697.00
  • >=2 Sets
    $49,600.00
Model Number:
CYKY-600-3HD
Lead Time:
Quantity(Sets) 1 - 1 >1
Est. Time(days) 45 Negotiable
Customization:
Customized logo (Min. Order: 1 Sets)
Customized packaging (Min. Order: 1 Sets)

More

Graphic customization (Min. Order: 1 Sets) Less
Report Suspicious Activity
Overview
Quick Details
Machine Type:
lab equipment
Place of Origin:
Henan, China
Brand Name:
cyky
Power(W):
2000W
Dimension(L*W*H):
L1300mm* W660mm*H1200mm
Warranty:
1 YEAR
After-sales Service Provided:
Field maintenance and repair service, Engineers available to service machinery overseas
Key Selling Points:
Competitive Price
After Warranty Service:
Video technical support, Online support
Applicable Industries:
Hotels, Garment Shops, Building Material Shops, Machinery Repair Shops, Manufacturing Plant, Food & Beverage Factory, Farms, Restaurant, Home Use, Retail, Food Shop, Printing Shops, Construction works , Energy & Mining, Food & Beverage Shops, Advertising Company
Local Service Location:
None
Showroom Location:
None
product:
Three-Heads Compact 2" Magnetron Plasma Sputtering Coater
vacuum chamber size:
300 mm Dia x 300 mm height
voltage:
220VAC 50/60Hz, single phase
input power:
2000W (including pump)
certificate:
CE
Delivery:
within 10 days
payment:
T/T in advance
warranty:
1 year
Keywords:
Magnetron Sputtering Coater
Condition:
New
Voltage:
220VAC 50/60Hz, single phase
Weight:
160KG
Certification:
CE
Type:
Magnetron Plasma Sputtering Coater
Substrate:
metal
Coating:
Magnetron Plasma Sputtering Coater
Supply Ability
Supply Ability:
290 Set/Sets per Month
Packaging & Delivery
Packaging Details
Plastic paper inside, polyfoam filled, plywood box outside
Port
Zhengzhou, Beijing, etc.
Picture Example:
package-img
Lead Time :
Quantity(Sets) 1 - 1 >1
Est. Time(days) 45 To be negotiated

Three target  magnetron sputtering coater with molecular pump system for coating glass wafer

Product Description

CYKY-600-3HD three target magnetron sputtering coating machine is a newly developed coating equipment, which can be used to prepare monolayer or multi-layer ferroelectric film, conductive film, alloy film, semiconductor film, ceramic film, dielectric film, optical Film, oxide film, hard film, polytetrafluoroethylene film, and the like. The CYKY-600-3HD three target magnetron sputtering device is equipped with three target guns, one supporting RF power supply for sputter coating of non-conductive targets, and two supporting DC power supplies for sputter coating of conductive materials. Compared with similar equipment, it is not only widely used, but also has the advantages of small size and easy operation. It is an ideal equipment for laboratory preparation of material films, especially suitable for laboratory research on solid electrolytes and OLEDs.

Equipment composition:

The CYKY-600-3HD three target magnetron sputtering device is equipped with three target guns, one supporting RF power supply for sputter coating of non-conductive targets, and two supporting DC power supplies for sputter coating of conductive materials

 

specification of the   Magnetron Plasma Sputtering Coater:

 

Compact Structure 
Input Power
  • 220VAC 50/60Hz, single phase
  • 2000W (including pump)
Magnetron Sputtering Head
  • Three 2" Magnetron Sputtering Heads with water cooling jackets are included ( click picture-left to see detailed specs ) to connect optional power source
  • Head Water Cooling: 10ml/min water flow required
  • 148 cm RF cable is replaceale with extra cost 
Source Power

  • The power source is optional with single DC power source, single RF power source or both DC and RF power source. 
  • (Please select it in the option bar)
    • DC source: 500W for coating metallic materials 
    • Compact 300 RF source for non-conductive materials 

Vacuum Chamber

  • Vacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steel
  • Observation Window: 100 mm diameter
  • Hinged type cover on top with air spring sport makes target exchange easy

 

Sample Holder

  • Sample holder size: 140mm dia. for. 4" wafer max
  • Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating
  • The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C

Gas Flow Control

  • Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in
  • Flow rate: 200 ml/min max.
  • Flow rate is adjustable on the 6" touch screen control panel
Vacuum Pump Station

  • High speed turbo vacuum pump system (made in Germany) is directly installed on the vacuum chamber for max. vacuum level
  • Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed
  • Mobile pump station is included and the compact sputtering coater can be put on top of station
  • Max. vacuum level: 10^-6 torr with chamber baking
Thickness Monitor


  • One Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 Å
  • LED Display Unit outside chamber can:
    • Input material to be coated according to data base included
    • Display total thickness coated and coating speed
  • 5 pcs quartz sensors (consumable) are included
  • Water cooling is required
Water Chiller

Overall Dimensions

L1300mm× W660mm× H1200mm

Net Weight

160 kg

 

 Display of the  Three-Heads Compact 2" Magnetron Plasma Sputtering Coater 

DC sputtering is also called cathode sputtering or two-pole sputtering.

Sputtering conditions: the working pressure is about 10 Pa, the sputtering voltage is 3000 V, the target current density is 0.5mA/cm2, and the film deposition rate is less than 0.1 mm/min.

Working principle: first let the inert gas (usually Ar gas) produce glow discharge phenomenon to generate charged ions; charged ion tight electric field accelerates impact on the surface of the target, so that the target atoms are bombarded and fly out, and at the same time generate secondary electrons, the gas atoms are struck to form more charged ions again; the target atoms carry enough kinetic energy to reach the surface of the coated object(substrate) for deposition. With the change of gas pressure, the deposition rate of sputtering film will have a maximum value, but under the condition of low pressure, the free path of electrons is longer, the probability of electrons disappearing on the cathode is larger. The probability of ionization of gas molecules through the collision process is low. and the probability of ions ejecting secondary electrons while sputtering on the anode is relatively small due to lower gas pressure, these all result in a very low rate of sputtering under low pressure conditions. It is not easy to maintain a self-sustaining discharge at a pressure of 1 Pa! As the gas pressure increases, the mean free path of the electron decreases, the ionization probability of the atom increases, the sputtering current increases, and the sputtering rate increases.

Suitable sputtering targets are light metals that are not easily oxidized, such as Au, Ag, Pt, etc.

RF sputtering is a technique that use the positive ions in a RF discharge plasma to bombard the target material, and sputtering out the target atoms so as to deposit them bon a grounded substrate surface.

 

Working conditions: RF sputtering can be performed at a low pressure of about 1 Pa, a sputtering voltage of 1000 V, a target current density of 1.0 mA/cm 2 , and a film deposition rate of 0.5 mm/min.

Working principle: People change the DC power supply to AC power. Since the positive and negative polarity of the AC power source alternates, when the sputtering target is in the positive half cycle, the electrons flow to the target surface, neutralize the positive charge accumulated on the surface, and accumulate electrons, making the surface exhibit a negative bias, Leading to attracting positive ions to bombard the target during the negative half cycle of the RF voltage, thereby achieving sputtering. Since the ion mass is larger than the electron mass, the mobility is small, and it is not concentrated to the target surface as quickly as the electron, so the position of the target surface rises slowly. Since a negative bias is formed on the target, the RF sputtering device can also sputter the conductor target. In a RF sputtering device, electrons in a plasma easily absorb energy in an RF field and oscillate within an electric field. Therefore, The probability that electrons collide with the working gas molecules and ionize them to generate ions becomes large, so that the breakdown voltage, the discharge voltage, and the operating pressure are significantly lowered.

Advantages: 1. It can be carried out under low pressure and the sputtering rate is high.

2. It can sputter not only metal targets but also insulating targets, and can thin any material in conductors, semiconductors, and insulators to be a film.

3. you must pay attention to the grounding problem.

The types of targets suitable for sputtering are various types of solid targets. Metal, semiconductor, and insulator targets can be sputtered, especially suitable for targets that are easy to produce oxidized insulating layer, such as Al, Ti, Mg and other metals and TiQ2, ZnO and other oxide targets.

 

DC sputtering is also called cathode sputtering or two-pole sputtering.

 

Sputtering conditions: the working pressure is about 10 Pa, the sputtering voltage is 3000 V, the target current density is 0.5mA/cm2, and the film deposition rate is less than 0.1 mm/min.

 

Working principle: first let the inert gas (usually Ar gas) produce glow discharge phenomenon to generate charged ions; charged ion tight electric field accelerates impact on the surface of the target, so that the target atoms are bombarded and fly out, and at the same time generate secondary electrons, the gas atoms are struck to form more charged ions again; the target atoms carry enough kinetic energy to reach the surface of the coated object(substrate) for deposition. With the change of gas pressure, the deposition rate of sputtering film will have a maximum value, but under the condition of low pressure, the free path of electrons is longer, the probability of electrons disappearing on the cathode is larger. The probability of ionization of gas molecules through the collision process is low. and the probability of ions ejecting secondary electrons while sputtering on the anode is relatively small due to lower gas pressure, these all result in a very low rate of sputtering under low pressure conditions. It is not easy to maintain a self-sustaining discharge at a pressure of 1 Pa! As the gas pressure increases, the mean free path of the electron decreases, the ionization probability of the atom increases, the sputtering current increases, and the sputtering rate increases.

Suitable sputtering targets are light metals that are not easily oxidized, such as Au, Ag, Pt, etc.

 

 

Related Products

Founded in 2005, Zhengzhou CY Scientific Instrument Co., Ltd. is a company specializing in the development and production of laboratory technology research equipment. The products are mixed, pressed, burned, cut, ground, polished, coated, analytical equipment and related consumables. Products include laboratory sintering equipment, coating equipment and so on. At present, it has been exported to 25 countries and regions such as the United States, Europe, and Southeast Asia, and has been well received by various scientific research units.

We have a mature technology research and development team, the number of technicians is 33, the company has 150 people, more than 500 square meters of office space, the factory covers an area of about 1,500 square meters located in Zhengzhou High-tech Zone Electronic Industrial Park. The products are mainly located in the research market, serving scientific research in the labs of universities and colleges, and can also customize products according to your needs.

Q. Are you a manufacturer or a trading company?

A. We are professional laboratory instrument manufacturers, have their own design team and factory, have mature technical experience, and can guarantee the quality of products and the optimal price.

Q. How is your company's product after-sales service system?

A. The product warranty period is 12 months, we can provide lifetime maintenance. We have professional pre-sales and after-sales departments that can respond to you within 24 hours to resolve any technical issues.

Q. How long is your delivery time? If I want to customize the instrument, how long does it take?

A.1. If the goods are in stock, it is 5-10 days. 2. We can provide customized services for our customers. It usually takes 30-60 days depending on the specifications of the custom instrument.

Q. Our country's power supply and plug are different. How do you solve it?

A. We can supply a transformer and plug according to your local requirements according to the power plug of different countries.

Q. How to pay?

A.T / T, L / C, D / P, etc., it is recommended to use Alibaba Trade Guarantee.

Q. How is the package of goods? Delivery methods?

A.1. Standard export fumigation sign wooden box packaging 2. Express, air, sea shipping according to customer requirements, find the most suitable way.

More questions, please contact customer service