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Semiconductor silicon wafer grinding polishing machine silicon wafer grinder

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Key attributes

Other attributes

Place of Origin
Henan, China

Warranty
3 years

Classification
Other

Customized support
OEM

Brand Name
CYKY

Model Number
semiconductor wafer grinding machine

Material
SS

Size
7 inch

Capacity
20ml

Polishing rotating speed
50-1000r/min

Motor
550W

Polishing pad diameter
dia.200mm

keyword
semiconductor wafer grinding machine

Warranty
one year

Lead time

Quantity (sets)1 - 1 > 1
Lead time (days)10To be negotiated

Customization

Customized logo
Min. order: 1
Customized packaging
Min. order: 1
Graphic customization
Min. order: 1

Know your supplier

Custom manufacturer10 Located in CN
Registered trademarks (1)
Services
Quality control

Order with confidence

Verified as Custom Manufacturer

Product descriptions from the supplier

1 - 1 sets
$3,200.00
>= 2 sets
$3,100.00

Variations

Total options:

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