Dual target high vacuum magnetron sputtering coating equipment for conductive films

FOB Reference Price:Get Latest Price
$18,590.00 - $39,600.00 / Set | 1 Set/Sets (Min. Order)
Model Number:
CYKY-300-2HD
Lead Time:
Quantity(Sets) 1 - 1 >1
Est. Time(days) 45 Negotiable
Customization:
Customized logo (Min. Order: 1 Sets)
Customized packaging (Min. Order: 1 Sets)

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Overview
Quick Details
Condition:
New
Type:
Magnetron Plasma Sputtering Coater
Substrate:
Aluminum
Machine Type:
lab coating machine
Coating:
Magnetron Plasma Sputtering Coater
Place of Origin:
Henan, China
Brand Name:
cyky
Voltage:
220VAC 50/60Hz, single phase
Power(W):
2000W
Dimension(L*W*H):
L1300mm* W660mm*H1200mm
Weight:
160KG
Certification:
CE
Warranty:
1 YEAR
After-sales Service Provided:
Field installation, commissioning and training, Field maintenance and repair service, Video technical support, Online support
Key Selling Points:
Easy to Operate
After Warranty Service:
No service
Applicable Industries:
Manufacturing Plant, laboratory
Local Service Location:
United States
Showroom Location:
United States
Application:
Lab Magnetron Sputtering Coating
product:
Dual target magnetron sputtering coating
vacuum chamber size:
300 mm Dia x 300 mm height
voltage:
220VAC 50/60Hz, single phase
input power:
2000W (including pump)
certificate:
CE
Control System:
7" Screen Intelligent Control System
Coating material:
Metallic or Non-metallic Materials
Rotation speed:
1 - 20 rpm adjustable for uniform coating
Keywords:
Magnetron Sputtering Coater
Supply Ability
Supply Ability:
100 Set/Sets per Month
Packaging & Delivery
Packaging Details
Plastic paper inside, polyfoam filled, plywood box outside
Port
Zhengzhou, Beijing, etc.
Picture Example:
package-img
Lead Time :
Quantity(Sets) 1 - 1 >1
Est. Time(days) 45 To be negotiated

Dual target high vacuum magnetron sputtering coating equipment for conductive films

Product Description

CYKY-300-2HD dual target magnetron sputtering coater is a high vacuum coating equipment independently developed by our company. It can be used to prepare monolayer or multi-layer ferroelectric film, conductive film, alloy film, semiconductor film and ceramic. Film, dielectric film, optical film, oxide film, hard film, polytetrafluoroethylene film, and the like. The CYKY-300-2HD dual-target magnetron sputtering coater is equipped with two target guns, one weak magnetic target is used for sputter coating of non-conductive materials and one strong magnetic target is used for sputter coating of ferromagnetic materials. Compared with similar equipment, it has the advantages of small size and easy operation, and a wide range of materials that can be used. It is an ideal equipment for preparing various types of material films in the laboratory.

Equipment composition:

The CYKY-300-2HD dual target magnetron sputtering coater is equipped with two target guns, one weak magnetic target is used for sputter coating of non-conductive materials and one strong magnetic target is used for sputter coating of ferromagnetic materials.

 

dual target magnetron sputtering coater parameters:: 

Name

CYKY-300-2HD dual target magnetron sputtering coater

Model

CYKY-300-2HD

Installation conditions

This equipment is required to be used at the altitude of 1000m or less, the temperature of 25± 15, and the humidity of 55% Rh ± 10% Rh.

1. Water: The equipment is equipped with a self-circulating chiller (filling pure water or deionized water)

2. Electricity: AC220V 50Hz, must have a good ground connection.

3. Gas: The equipment chamber needs to be filled with argon gas (purity of 99.99% or more). Self-provided argon gas cylinder (with Ø6mm double ferrule joint) and pressure reducing valve

4. Workbench: size 650mm × 600mm × 700mm, bearing more than 200kg

5. Ventilation device: need

Main features

1. Configure two target guns, A matching RF power supply is used for sputter coating of non-conductive targets, and a matching DC power supply is used for sputter coating of conductive materials.

2. It can prepare a variety of films, and has a wide range of applications.

3. It is small in size and easy to operate.

Technical parameters

1. the power supply voltage: 220V 50Hz

2. rated power: 1200W (excluding vacuum pump)

3. Working vacuum degree: 10-4Pa

4. working temperature: RT-500, accuracy ± 1×(you can increase the temperature according to actual needs)

5. the number of target guns: 1

6. target gun cooling method: water cooling

7. Target size: Ø2’’, thickness 0.1-5mm (different thickness depending on target material)

8. DC sputtering power: 500W (optional)

9. RF sputtering power: 300W / 500W (optional)

10. loading sample table: Ø140mm

11. the sample table speed: adjustable within 1rpm-20rpm

12. Protective gas: inert gases such as Ar and N2

13. Intake gas path: mass flow meter controls 2 channels of intake air, flow rate is 200SCCM

Product specification

Main unit size: 500mm × 560mm × 660mm, the whole machine size: 1300mm × 660mm × 1200mm; weight: 160kg

Standard accessories

1

DC power control system

1

2

RF power control system

1

3

Film thickness monitor system

1

4

Molecular pump

1

5

Chiller

1

6

Cooling water pipe (Ø6mm)

4

Product specification

Various targets such as gold, indium, silver, and platinum

 

 Display of the  Three-Heads Compact 2" Magnetron Plasma Sputtering Coater 

 

 

DC sputtering is also called cathode sputtering or two-pole sputtering.

Sputtering conditions: the working pressure is about 10 Pa, the sputtering voltage is 3000 V, the target current density is 0.5mA/cm2, and the film deposition rate is less than 0.1 mm/min.

Working principle: first let the inert gas (usually Ar gas) produce glow discharge phenomenon to generate charged ions; charged ion tight electric field accelerates impact on the surface of the target, so that the target atoms are bombarded and fly out, and at the same time generate secondary electrons, the gas atoms are struck to form more charged ions again; the target atoms carry enough kinetic energy to reach the surface of the coated object(substrate) for deposition. With the change of gas pressure, the deposition rate of sputtering film will have a maximum value, but under the condition of low pressure, the free path of electrons is longer, the probability of electrons disappearing on the cathode is larger. The probability of ionization of gas molecules through the collision process is low. and the probability of ions ejecting secondary electrons while sputtering on the anode is relatively small due to lower gas pressure, these all result in a very low rate of sputtering under low pressure conditions. It is not easy to maintain a self-sustaining discharge at a pressure of 1 Pa! As the gas pressure increases, the mean free path of the electron decreases, the ionization probability of the atom increases, the sputtering current increases, and the sputtering rate increases.

Suitable sputtering targets are light metals that are not easily oxidized, such as Au, Ag, Pt, etc.

RF sputtering is a technique that use the positive ions in a RF discharge plasma to bombard the target material, and sputtering out the target atoms so as to deposit them bon a grounded substrate surface.

 

Working conditions: RF sputtering can be performed at a low pressure of about 1 Pa, a sputtering voltage of 1000 V, a target current density of 1.0 mA/cm 2 , and a film deposition rate of 0.5 mm/min.

Working principle: People change the DC power supply to AC power. Since the positive and negative polarity of the AC power source alternates, when the sputtering target is in the positive half cycle, the electrons flow to the target surface, neutralize the positive charge accumulated on the surface, and accumulate electrons, making the surface exhibit a negative bias, Leading to attracting positive ions to bombard the target during the negative half cycle of the RF voltage, thereby achieving sputtering. Since the ion mass is larger than the electron mass, the mobility is small, and it is not concentrated to the target surface as quickly as the electron, so the position of the target surface rises slowly. Since a negative bias is formed on the target, the RF sputtering device can also sputter the conductor target. In a RF sputtering device, electrons in a plasma easily absorb energy in an RF field and oscillate within an electric field. Therefore, The probability that electrons collide with the working gas molecules and ionize them to generate ions becomes large, so that the breakdown voltage, the discharge voltage, and the operating pressure are significantly lowered.

Advantages:

1. It can be carried out under low pressure and the sputtering rate is high.

2. It can sputter not only metal targets but also insulating targets, and can thin any material in conductors, semiconductors, and insulators to be a film.

3. you must pay attention to the grounding problem.

The types of targets suitable for sputtering are various types of solid targets. Metal, semiconductor, and insulator targets can be sputtered, especially suitable for targets that are easy to produce oxidized insulating layer, such as Al, Ti, Mg and other metals and TiQ2, ZnO and other oxide targets.

 

DC sputtering is also called cathode sputtering or two-pole sputtering.

 

Sputtering conditions: the working pressure is about 10 Pa, the sputtering voltage is 3000 V, the target current density is 0.5mA/cm2, and the film deposition rate is less than 0.1 mm/min.

 

Working principle: first let the inert gas (usually Ar gas) produce glow discharge phenomenon to generate charged ions; charged ion tight electric field accelerates impact on the surface of the target, so that the target atoms are bombarded and fly out, and at the same time generate secondary electrons, the gas atoms are struck to form more charged ions again; the target atoms carry enough kinetic energy to reach the surface of the coated object(substrate) for deposition. With the change of gas pressure, the deposition rate of sputtering film will have a maximum value, but under the condition of low pressure, the free path of electrons is longer, the probability of electrons disappearing on the cathode is larger. The probability of ionization of gas molecules through the collision process is low. and the probability of ions ejecting secondary electrons while sputtering on the anode is relatively small due to lower gas pressure, these all result in a very low rate of sputtering under low pressure conditions. It is not easy to maintain a self-sustaining discharge at a pressure of 1 Pa! As the gas pressure increases, the mean free path of the electron decreases, the ionization probability of the atom increases, the sputtering current increases, and the sputtering rate increases.

Suitable sputtering targets are light metals that are not easily oxidized, such as Au, Ag, Pt, etc.

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Related Products

Founded in 2005, Zhengzhou CY Scientific Instrument Co., Ltd. is a company specializing in the development and production of laboratory technology research equipment. The products are mixed, pressed, burned, cut, ground, polished, coated, analytical equipment and related consumables. Products include laboratory sintering equipment, coating equipment and so on. At present, it has been exported to 25 countries and regions such as the United States, Europe, and Southeast Asia, and has been well received by various scientific research units.

We have a mature technology research and development team, the number of technicians is 33, the company has 150 people, more than 500 square meters of office space, the factory covers an area of about 1,500 square meters located in Zhengzhou High-tech Zone Electronic Industrial Park. The products are mainly located in the research market, serving scientific research in the labs of universities and colleges, and can also customize products according to your needs.

Q. Are you a manufacturer or a trading company?

A. We are professional laboratory instrument manufacturers, have their own design team and factory, have mature technical experience, and can guarantee the quality of products and the optimal price.

Q. How is your company's product after-sales service system?

A. The product warranty period is 12 months, we can provide lifetime maintenance. We have professional pre-sales and after-sales departments that can respond to you within 24 hours to resolve any technical issues.

Q. How long is your delivery time? If I want to customize the instrument, how long does it take?

A.1. If the goods are in stock, it is 5-10 days. 2. We can provide customized services for our customers. It usually takes 30-60 days depending on the specifications of the custom instrument.

Q. Our country's power supply and plug are different. How do you solve it?

A. We can supply a transformer and plug according to your local requirements according to the power plug of different countries.

Q. How to pay?

A.T / T, L / C, D / P, etc., it is recommended to use Alibaba Trade Guarantee.

Q. How is the package of goods? Delivery methods?

A.1. Standard export fumigation sign wooden box packaging 2. Express, air, sea shipping according to customer requirements, find the most suitable way.

More questions, please contact customer service